1.54” 240×240 IPS Industrial Grade High-Brightness Display Module Datasheet

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1. Scope of Supply & Core Compliance

This formal specification applies exclusively to the certified 1.54” TFT LCD module supplied by Shenzhen Tianxianwei Technology Co., Ltd. All units delivered follow a strict lead-free manufacturing workflow, and fully meet RoHS environmental compliance requirements for global industrial deployment.
The product features a native 240xRGBx240 pixel resolution, powered by the ST7789V2 industrial-grade display driver IC. For unlisted low-level register configuration details, developers may refer to the official ST7789V2 IC datasheet released by the chip vendor.

Core Hardware Architecture Features

The module adopts a 4-layer stacked structural design of TFT PANEL + DRIVER IC + FPC + EDGE-TYPE BACKLIGHT, built on an IPS wide-view normally black active matrix backplane with 240 segment output channels and 240 common output channels. The 4-line 4-wire SPI interface supports selectable 65K/262K color rendering modes via register configuration, with no additional external calibration components required.
The raw FPC is shipped in an unfolded single-layer state, with all signal traces impedance matched to meet standard industrial SPI signal integrity requirements.

2. General LCM Performance Specifications

All specifications below are validated and certified for batch industrial production:

• LCD Operating Principle: Normally Black Transmissive Active Matrix TFT
• Native Resolution: 240 (Horizontal RGB Sub-pixel) x 240 (Vertical) Dots
• Pixel Layout: Standard RGB Stripe arrangement
• Pixel Pitch (H x V): 0.1155mm × 0.1155mm
• Active Display Area: 27.72mm (Width) × 27.72mm (Height)
• Viewing Performance: Full ALL O'CLOCK omnidirectional viewing, no grayscale shift or color cast at any observing angle
• Integrated Display Driver IC: ST7789V2-G4-A
• Host Communication Interface: 4-line Serial SPI
• Overall LCM Dimension (W x H x T): 31.52mm × 33.72mm × 1.81mm
• Certified Unspecified Dimensional Tolerance: ±0.20mm
• Developer Structural Recommendation: For integrated touch overlay implementation, reserve an extra 0.3~0.5mm margin on each side of the touch panel window relative to the LCM active display area to eliminate edge touch dead zones

• Standard Backlight & Optical Ratings
• The edge-type backlight integrates 3 high-reliability white LED chips:

• Typical Full LCM Brightness (9-point average): 900 cd/m²
• Minimum Backlight Uniformity: ≥80%
• Typical Forward Operating Current (If): 60mA
• LED Forward Voltage Range (Vf): 2.8V ~ 3.2V
• Rated LED Service Lifetime: 30,000 hours. Lifetime is defined as the duration when the total LCM brightness attenuates to 50% of the factory calibrated initial value at 20mA per LED operating current. Note that operating single LED above 25mA will lead to exponential reduction of backlight lifetime.

3. Absolute Maximum Operating Ratings

To prevent permanent hardware damage and guarantee long-term stable operation, the module's absolute operating boundaries are strictly defined below:

• LCM Continuous Operating Temperature Range: -20°C ~ +60°C
• LCM Non-operating Storage Temperature Range: -30°C ~ +70°C
• Maximum Allowable Relative Humidity (Non-condensing): ≤90% RH
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4. Certified Electrical Characteristics

All electrical parameters are tested under 25°C room temperature standard conditions, with a 60Hz default frame rate:

• Operating Frame Rate: 60Hz (factory calibrated, adjustable via register configuration)
• Power Supply for Internal DC/DC Conversion (VDD): 2.5V ~ 3.3V, typical rated 2.8V
• Typical Active Operating Current: 10mA
• Deep Sleep Standby Current: 150μA, optimized for ultra-low power battery-powered industrial edge devices
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5. 11-Pin FPC Interface Definition

All pins follow industrial standard signal naming conventions, for direct compatibility with mainstream low-power industrial MCUs and SoCs without extra level shifting circuits:

1. Pin 1 (Symbol VCC/VCI): Main display power supply input, operating range 2.5~3.3V
2. Pin 2 (Symbol RESET): Hardware global reset input, active low
3. Pin 3 (Symbol SDO): Serial data output pin for bidirectional SPI half-duplex communication
4. Pin 4 (Symbol CSX): Chip selection signal, active low to enable SPI communication
5. Pin 5 (Symbol SCL): Serial SPI clock signal input
6. Pin 6 (Symbol VSS): System power ground reference
7. Pin 7 (Symbol SDA): Serial data input/output pin for SPI transmission
8. Pin 8 (Symbol D/CX): Register selection signal, to distinguish command and data transmission
9. Pin 9 (Symbol TE): Tearing effect frame sync head pulse output, to achieve frame phase lock between host rendering and display scanning
10. Pin 10 (Symbol LEDA): Backlight anode positive power input
11. Pin 11 (Symbol LEDK): Backlight cathode negative power input
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6. Industrial Grade Reliability Validation

All batch production units pass full stress screening before delivery, per the certified test matrix below:

• High Temperature Storage: 96 hours continuous storage at +70°C
• Low Temperature Storage: 96 hours continuous storage at -30°C
• High Temperature Continuous Operation: 96 hours powered running at +60°C
• Low Temperature Continuous Operation: 96 hours powered running at -20°C
• High Temperature & High Humidity Storage: 96 hours non-condensing storage at 50°C / 90% RH
• Thermal Cycling Shock: 50 cycles of alternating temperature shock, each cycle consists of 30 minutes holding at -20°C and 30 minutes holding at +60°C under static unpowered state

Post-test pass criteria strictly follow industrial standards: All functions operate normally without defect. No missing segments, short circuits, blurry display areas, complete non-display, abnormal visual artifacts or liquid crystal leakage are allowed. No low-temperature internal bubbles, sealing edge peeling or frame rainbow pattern issues are permitted.

The packaging specification is confirmed to be customized per customer's batch requirement.